The main components of the product are optoelectronic devices(TOSA,ROSA,BOSA), shell (optical interface) and PCBA.
◆ TOSA(Transmitting Optical Sub-Assembly), with 4 PINS; ROSA(Receiving Optical Sub-Assembly), with 5 PINS; BOSA(Bi-Directional Optical Sub-Assembly), with 9 PINS.
◆ PCBA is a circuit board. Engineers will select the different chip design according to the projects. The common chips are SEMTECH, UXUN, Maxim and Macom.
◆ The optical module shell is generally divided into single and dual fiber. According to the interface type, mainly divided into LC and SC.
Different types of optoelectronic devices, the raw materials are not exactly the same, as follows:
TOSA: TO-CAN, ceramic cores, tube(Metal in general)
Classification of ceramic cores
※ Precision: single mode ceramic core and multimode ceramic core
※ outside diameter: SC(2.5mm) , LC(1.25mm)
Major chip manufacturers:
Japan: Mitsubishi, Sumitomo
USA: CY(CYoptics), AOI
Taiwan: LuxNet, Truelight
ROSA: PIN-TIA 、tube(Plastic in general)
PIN-TIA chip manufacturers:
Domestic: Fiberhome, Mignal, Opto Sensor Tech
Abroad: NT(Nanotech), Oclaro, SEMTECH etc.
BOSA: TO-CAN, ceramic cores, tube and filters
HTFuture aim to be your Reliable Partner for different kinds of Compatible transceiver (QSFP28, QSFP+, SFP, XFP, SFP+ etc) | OTN optical transmission system|DWDM Mux Demux|OADM | OTU | EDFA | NMS | DCM | OLP | OBP etc| More information, welcome to contact Ivy or skype: sales6@htfuture.com
Provide fiber optic products and WDM systematic solution. sales6@htfuture.com (Ivy) Wavelength division multiplexer(WDM/CWDM/DWDM/OADM), Fiber Optic Transceivers(SFP, SFP+, XFP, 10G QSFP+, 40G QSFP+ and 100G CFP2), OEO Converter Repeater, Ethernet Media Converter, Fiber Optical Patch cord and Fiber Optical assembly.
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